Job Description

　　As a Semiconductor Packaging Development Graduate Intern, you will work in materials characterization labs of Assembly and Test Technology Development (ATTD) focusing on test method development for electronic packaging materials.

　　Specific responsibilities will include, but not be limited to:

　　Develop a lab tool for liquid wetting and spreading study on solid surfaces.The candidate will need to design fixtures, work on tool set up, and develop test method.Work in a cross functional team for innovative rheology and wetting test methods development using rheometers, dynamic contact angle system, AFM, and laser confocal microscope, etc.

　　Responsibilities may be quite diverse of a technical nature. U.S. experience and education requirements will vary significantly depending on the unique needs of the job. Job assignments are usually for the summer or for short periods during breaks from school.

　　Qualifications

　　You must possess the below requirements to be initially considered for this position.

　　Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

　　Knowledge and/or experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.

　　Minimum Qualifications:

　　Candidate must be actively pursuing a Ph.D. degree on Chemical Engineering, Materials Science and Engineering, Chemistry, Physics, or related field of study.6+ months of knowledge and/or experience in a relevant area.

　　Preferred Qualifications:

　　Strong background in polymer rheology, solder wetting, and wetting analysis method and surface chemistryGood understanding of the fundamentals of materials/polymers, processing, and structure-property relationships.AFM and laser confocal microscope experience is a plusData analysis, and statistical design.Good problem solving and communication skillsTeam player demonstrated, through team projects or other research activities

　　Inside this Business Group

　　As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth.

　　Posting Statement

　　All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

　　Benefits

　　We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.

　　Working Model

　　This role will require an on-site presence.