Job Description

　　We have a passion for leading the industry and changing the world. The internship candidate will be responsible for performing world class transmission electron microscopy (TEM) analysis and providing microscopy solutions for critical problems in support of Intel's next generation silicon process development, pathfinding and failure analysis.Requires use of all TEM-related imaging and analysis techniques and development of novel characterization techniques to characterize the process and solve process problem that is critical to enhance performance, yield and reliability. Work closely with process, yield and reliability engineers for design of experiments and obtaining results to identify and solve problems. Work closely with other TEM and analytical lab engineers to discuss experimental results, share knowledge and learning, continuously learn, develop and innovate. Work closely with TEM sample preparation artists to understand and meet requirements as well as challenges.Maintains necessary records and reports. Performs other related duties as required or as directed.Responsibilities may be quite diverse of a technical nature. Experience and education requirements will vary significantly depending on the unique needs of the job. Job assignments are usually for the summer or for short periods during breaks from school.

　　Qualifications

　　You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork/classes/research and/or relevant previous job and/or internship experiences.

　　Minimum Qualifications:

　　Candidate must be enrolled in a MS or PhD degree in Materials Science, Chemistry, Chemical Engineering, Physics or related field.6 + months of experience in transmission electron microscopy (TEM) techniques.

　　Preferred Qualifications:

　　Candidate must have one of the following:

　　Hands on experience of physical TEM sample preparation techniques including using dual beam FIB liftout technique.Experience in programming and simulation of electron microscopy results or data analysis and image processing.Experience with the relationship between microstructure and properties of materials.Experience with device physics, thin film/surface materials characterization techniques, failure analysis techniques and reliability failure mechanisms.

　　Inside this Business Group

　　Manufacturing and Product Engineering (MPE) is responsible for test development across product segments, supporting 95% of Intel's revenue. We deliver comprehensive pre-production test suites and component/physical debug capabilities to enable high quality, high volume manufacturing.

　　Posting Statement

　　All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

　　Benefits

　　We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.

　　Working Model

　　This role will require an on-site presence.