The Quantum Information and Integrated Nanosystems Group conducts quantum information science research from a shared foundation of innovative control-signal design, outstanding fabrication tools, and well-equipped measurement infrastructure. The group has a broad range of experimental and prototyping activities. The group's quantum information science activities include the development of superconducting and trapped-ion qubits and quantum sensing with nitrogen-vacancy (NV) centers in diamond. In addition, the group has robust capabilities in classical superconducting circuits and integrated photonics. These component technologies are used in synergy with quantum information science demonstrations, as well as in standalone applications that include beyond-CMOS circuit technologies, energy-starved sensors, compact optical communication and laser radar transceivers, and microwave photonic signal processing.

　　Job Description

　　The Quantum Information and Integrated Nanosystems Group seeks an individual to assist in the electrical-optical-mechanical packaging and characterization of photonic components and integrated circuits (PICs). These components and PICs involve several technologies including silicon-foundry-based devices and PICs, compound-semiconductor (e.g., InP, GaAs, GaN) active devices, and hybrid and heterogeneous integration techniques. These devices find applications in a wide range of systems including trapped-ion-based computers and clocks, microwave photonics, directed energy, lidar, sensing, and communications. Example devices include hybrid-integrated PICs, high-power diode and quantum cascade lasers, optical amplifiers, high-current waveguide photodiodes, wideband optical modulators, and arrays of these devices. The successful candidate will be a member of a multi-disciplinary team whose mission is to develop packaged prototypes of advanced devices and integrated subsystems.

　　Responsibilities

　　*Lead the design, modeling, component procurement and assembly of various packaging configurations for photonic components and PICs under development. Packaging solutions enable testing new device designs and/or provide integration into advanced electro-optic systems. *Support testing and characterization of new photonic components and PICs at the device and packaged system level. *Operate packaging fabrication and assembly tools, as well as testing equipment. *Document and communicate packaging solutions and/or device performance results to internal team members and external vendors, partners, and sponsors.

　　Requirements

　　• Master’s degree in Mechanical Engineering, Electrical Engineering, Materials Science and Engineering, Physics, or related field. • Three or more years of experience in the packaging, electrical distribution, and thermal management of photonic components and PICs. • Experience using optoelectronic packaging equipment, such as thin film deposition tools (e-beam evaporation and sputtering), photolithography systems and techniques, flip chip bonding and vacuum reflow tools, wafer cleaving tools, wire bonders, etc. • Experience with the development, programming, and use of automated electronic-photonic test equipment. • Hands-on experience working in a clean room laboratory, either in educational or professional settings. • Excellent documentation and communication skills Preferred Qualifications • Experience with design, modeling and data acquisition software is desirable, such as Solid Works, COMSOL Multiphysics, Ansys, LabView, Matlab. • Experience with software programing for data acquisition and analysis using languages including Python, C, C++, or Matlab. • Experience in both research laboratory and industrial production environments. • Familiarity with the interplay between photonic component design, packaging and performance.

　　At MIT Lincoln Laboratory, our exceptional career opportunities include many outstanding benefits to help you stay healthy, feel supported, and enjoy a fulfilling work-life balance. Benefits offered to employees include:

　　Comprehensive health, dental, and vision plans

　　MIT-funded pension

　　Matching 401K

　　Paid leave (including vacation, sick, parental, military, etc.)

　　Tuition reimbursement and continuing education programs

　　Mentorship programs

　　A range of work-life balance options

　　... and much more!

　　Please visit our Benefits page (https://hr.mit.edu/benefits) for more information. As an employee of MIT, you can also take advantage of other voluntary benefits, discounts and perks (https://hr.mit.edu/benefits/additional) .

　　Selected candidate will be subject to a pre-employment background investigation and must be able to obtain and maintain a Secret level DoD security clearance.

　　MIT Lincoln Laboratory is an Equal Employment Opportunity (EEO) employer. All qualified applicants will receive consideration for employment and will not be discriminated against on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, age, veteran status, disability status, or genetic information; U.S. citizenship is required.

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