Senior Engineer I, BB Process Engineering

　　Fort Washington, PA, United States

　　JOB DESCRIPTION

　　Research, development, and engineering of advanced Wire Bonding process and consumable tools for use in cutting-edge semiconductor assembly technologies.  Role and responsibilities include product design definition, data and failure analysis, product performance simulations and process optimization for solution integration. While applying a well-balanced design to cost/performance approach, the candidate will accompany the product development processes from the conceptual stage using advanced laboratory testing equipment and methodologies.

　　RESPONSIBILITIES

　　Develops solutions to assigned engineering projects including detailed design, analysis, development and organization of electro-mechanical and / or software systems, consisting of specialized sub-systems and their integration into products and applications.

　　Solves a wide range of difficult problems within an engineering discipline in imaginative and practical ways, utilizes experimental methods such as design of experiments (DOE), analysis of variants, linear regression analysis, statistical process and control.

　　Analysis of situation or data requiring detailed evaluation of identifiable factors, exercises judgment within broadly defined practices and policies in selecting methods, techniques and evaluation criteria for obtaining results.

　　Assist in preparation of engineering plans and programs.

　　Independent operating of wire bonders and other test and measurement equipment.

　　Receive minimal instruction on new assignments and provide technical guidance and leads or coordinates the activities of other engineers, designers and technicians.

　　Running tests on bench or on the wire bonder.

　　Collect and analyze data and write engineering report and presentations.

　　Tests could involve using oscilloscope and other instrument.

　　Finite element analysis as needed.

　　QUALIFICATIONS

　　Knowledge & Experience requirements

　　3-10 years of general related semiconductor equipment, process and tool experience. Wire bonding or wedge bonding experience is a plus.Solid background in engineering, statistical analysis and familiarity with conducting complex DOE's (Design of Experiments).Knowledge and experience in the used of these software tools is a plus:Finite Element Analysis (FEA), ANSYS or similarJMP statistical softwareSolidworks or equivalent parametric 3D CAD softwareMatlabPythonAdvanced proficiency in Excel. Education Requirements•    Master or Bachelor's degree in Mechanical engineering, Mechatronics Engineering or equivalent.Other requirements•    Good written and verbal communication, interpretation and interpersonal skills •    Flexible to changes in tasks and work environment •    Must be organized, systematic, punctual, and goal-oriented •    Strong leadership skill with ability to work with cross functional teams •    Willing to travel on a need basis

　　We offer a competitive salary and a comprehensive benefits package including life, medical, dental, vision, flexible spending accounts, disability coverage, 401k with company contributions as well as many other options to employees.

　　Kulicke & Soffa is an Equal Opportunity/Affirmative Action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, disability, or protected veteran status.