Job Description

　　Drives end to end development for substrate design from concept through tapeout and implements physical layout and routing of the package design. Performs substrate fit and routing studies to establish design, performance, and cost tradeoffs. Works closely with silicon and hardware teams to optimize siliconpackageboard performance and pinout. Defines substrate design rules, conducts internal and external reviews, analyzes data, and resolves DRCs to optimize package design. Completes documentation and collateral into the product lifecycle management system of record.

　　Qualifications

　　Minimum Qualifications-- Minimum of a Bachelor of Science degree in an Electrical, Computer, Mechanical, Chemical Engineering field or physics.-- 3+years of prior experience/exposure with physical design (Package/PCB).-- Demonstrate experience with Mentor Graphics Expedition Software and other Package related SW suites.

　　Additional Preferred Qualifications:-- Experience with high-speed layout techniques that involved parallel and serial differential interfaces-- Experience in Package/Substrate technology development-- Ability to use Windows based office Suite (MS Excel, MS Powerpoint, MS Word etc)-- Exposure to process driven execution track record would be preferred.-- Strong communication and team player mentality.

　　Inside this Business Group

　　The Data Platforms Engineering and Architecture (DPEA) Group invents, designs & builds the world's most critical computing platforms which fuel Intel's most important business and solve the world's most fundamental problems. DPEA enables that data center which is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.

　　Posting Statement

　　All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

　　Benefits

　　We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. (https://jobs.intel.com/en/benefits)

　　It has come to our notice that some people have received fake job interview letters ostensibly issued by Intel, inviting them to attend interviews in Intel’s offices for various positions and further requiring them to deposit money to be eligible for the interviews. We wish to bring to your notice that these letters are not issued by Intel or any of its authorized representatives. Hiring at Intel is based purely on merit and Intel does not ask or require candidates to deposit any money. We would urge people interested in working for Intel, to apply directly at https://jobs.intel.com/ and not fall prey to unscrupulous elements.

　　Working Model

　　This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.