Semiconductor Process Engineer, IBM Corporation, Albany, NY (Up to 40% of telecommuting permitted): Maintain the health of the equipment by collaborating with equipment vendors, fab operations, process, and management teams. Use web based statistical process control charts (wSPC), SiView (software to manage wafer movement and tool processing) to collect the wafer history and related data, and web-based software to analyze the contamination, particle, and elemental data available from the wafers. Design experiments to develop new processes for advanced technologies. Assess the process window, formulate design of experiments (DOE’s) and make continuous improvement to stabilize processes. Work with tool vendor and internal equipment team to finalize technical specifications for new 300 mm tools and actively work with them throughout the installation and qualification of the tool as well as evaluate and implement new processes in the tool. Work with equipment vendors, material vendors, and the internal teams to drive development of new materials/processes, create data packages and implement processes on 300mm tools. Perform industry research on latest semiconductor equipment and process advancements and generate intellectual property (IP) for company and protect this IP through the patenting process. Utilize: Statistical Process Control (SPC), Design of Experiment (DOE), Thin films deposition (CVD/ PECVD), Lean manufacturing methodologies, Front end of the line process integration, Fab Operations, Operation and process specification document and training document writing. Required: Master’s degree or equivalent in Computer Science, Engineering, Electronic Engineering or related (employer will accept a Bachelor's degree plus five (5) years of progressive experience in lieu of a Master’s degree) and one (1) year of experience as an Electrical Engineer, Process Engineer or related. One (1) year of experience must include utilizing Statistical Process Control (SPC), Design of Experiment (DOE), Thin films deposition (CVD/ PECVD), Lean manufacturing methodologies, Front end of the line process integration, Fab Operations, Operation and process specification document and training document writing. $146,005.56 to 185,800.00 per year. Please send resumes to [email protected]. Applicants must reference V87 in the subject line.

　　Minimum Salary: 146005.00Maximum Salary: 185800.00Salary Unit: Yearly