In our Semiconductors business unit in Lenzburg, we develop and produce high-performance state of the art semiconductors power module for applications in different fields like rail transportation, power transmission, renewable energy, eMobility and more.

　　Your responsibilities

　　Develop new packaging technologies for power electronics (PE) modules to enable higher current capability, sustain higher temperatures and stresses under harsh environmental conditionsSupport the build-up and characterization of prototypes of IGBT modules for quality assessment using several techniques such as scanning acoustic microscopy, cross-sections, electrical and reliability testingConduct design of experiments (DoEs) to support technology development through process and materials optimizationInteract and collaborate with a dynamic and multidisciplinary team that will supervise and guide the projectUse your strong technical background, motivation to develop innovative solutions, and goal-oriented approach to make a significant impact on the projectContribute in building a stronger and more sustainable energy future

　　The duration of the internship is six months.

　　Your background

　　Currently pursuing a degree in material sciences, mechanical engineering, chemistry, physics, or similar discipline (B.Sc. or M.Sc. degree internship and/or thesis)Experience in laboratory work and know-how in sample preparation and material characterization techniquesKnow-how in data analysis tools and statistics is advantageousStrong problem-solving skills, with the ability to think creatively and independently to resolve technical challengesExcellent communication skills, both written and verbal, to effectively document the design and present results to the teamFluent in English, German is a plusA self-starter with a strong work ethic and the ability to work independently or as part of a teamWillingness to learn new concepts and technologies related to semiconductor packagingAvailability 5 - 10 months