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FabVantage Advanced Packaging Director VI - (E6)
FabVantage Advanced Packaging Director VI - (E6)-February 2024
Hsinchu
Feb 28, 2026
About FabVantage Advanced Packaging Director VI - (E6)

  Applied Materials FabVantage

  Applied Materials’ FabVantage Consulting Group was established specifically to help Semiconductor Manufacturing customers resolve their most difficult challenges. Part of the company’s Applied Global Services (AGS) business, FabVantage consulting combines the skill and knowledge of seasoned fab experts with state-of-the-art modeling and analysis tools, and with Applied’s deep systems and technology roots to resolve a Fab’s yield, productivity, process control and cost issues.

  Key Responsibilities

  Directs a process technology group responsible for research, development, and implementation in new products and extensions or enhancements to existing product lines

  Manages unusually complex, practical applications of scientific theory and processes in the development and ongoing technical management of the unit's products

  Engages with customers at a senior and management level to identify High Value Problems.

  Interacts and offers solutions to address external customers unusually complex process issues to address customers High-Value Problems (HVP) involving the business unit's product line

  Participates in strategic planning to integrate research and development processes with both the unit and the Product Business Group's overall business plan

  Provides approval guidelines and leadership to reporting process technology managers in the area of long-term strategy related to process development

  Defines performance metrics and reports on the organization's progress against specific goals

  Proliferates TES learnings to SBU/BU. Identifies & deploys new analytical methods. Can Issue the report and convince customer which including explain the priority and provide the suggestion based on the compare BOM, EC ,FSS data and FV360 for two products.

  Oversee technical development of junior level MPE's

  Qualifications

  Above 15 years of working experience in the semiconductor industry, and focus on advanced packaging technology

  Proven experience in technical project management, HVM's customers' interaction, and AMAT packaging tools

  Solid knowledge of hybrid packaging, TSV, or flip-chip process

  Excellent communication skills in English and Mandarin

  Able to support significant domestic/international business travel (Flexible about base location)

  Qualifications

  Education:

  Bachelor's Degree

  Skills:

  Certifications:

  Languages:

  Years of Experience:

  10 - 15 Years

  Work Experience:

  Additional Information

  Time Type:

  Full time

  Employee Type:

  Assignee / Regular

  Travel:

  Yes, 20% of the Time

  Relocation Eligible:

  No

  Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

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