Job Description

　　· Fab Sort Manufacturing (FSM) is responsible for the production of all Intel silicon using some of the world's most advanced manufacturing processes in fabs in Arizona, Ireland, Israel, Oregon and 2 new greenfield sites in Ohio and Germany. As part of Intel's IDM2.0 strategy, FSM is rapidly expanding its operation to deliver output for both internal and foundry customers with state-of-the-art technologies arriving in high-volume manufacturing at a 2-year cadence going forward. Intel recently created HVM Global Yield organization in FSM to strengthen its yield operation and enable fast-paced yield ramp-up in early HVM phases for each technology in collaboration with Technology Development team and FSM fab managers.

　　This job requisition is to seek BEOL (Back-End-Of-Line) Process Integration Principal / Sr. Principal engineering role in FSM HVM Global Yield organization, reporting to BEOL Process Integration manager. Selected candidate will own technical projects and lead other members in BEOL integration, other teams in Global Yield org, fab module, yield, and TD team members to achieve yield ramp-up and process optimization in early production stage, supporting internal and external customers.

　　BEOL (Back-End-Of-Line) Integration Principal engineer's responsibilities include (but not limited to):

　　· Lead complex and cross-organizational engineering projects to execute HVM yield roadmap, device targeting and attain performance targets, focusing on Cu BEOL integration.

　　· Partner with BEOL Technology Development team to lead new technology transfer projects to production fabs.

　　· Lead a group of FEOL/BEOL Integration, Device, Defect Reduction and Yield Analysis team members to identify root cause of yield/performance issues and implement mitigation plan in defined timeline to meet committed production yield/performance targets and to support fast paced yield ramp-up in high-volume manufacturing phases.

　　· Own NPI (New Product Introduction) in production fabs and lead engineering tasks for product-specific process optimizations to meet foundry customers specifications and requirements.

　　· Lead engineering projects to improve product yield, quality, performance and to reduce wafer cost.

　　· Coordinate Process Integration team engineering support for technical interactions with internal and external customers.

　　Qualifications

　　Master's or Ph.D. in Electrical Engineering, Physics or Materials Science major.

　　15+ years of engineering experience in advanced node semiconductor industry in Cu BEOL Process and Integration.

　　10+ years of experience in technology development or high-volume manufacturing. Integration experience in EUV-enabled technology nodes is strongly preferred.

　　10+ years of experience in interaction with MOL module (Middle-Of-Line, Contact module).

　　10+ years of experience in collaborating with module processes including lithography, dry etch, wet etch, CMP, thin films and metrology.

　　Hands-on experience in new semiconductor technology development

　　Problem-solving and project/program/TFT leadership experience with strong self-initiative and self-learning capabilities.

　　Proven track record of working across organizations through matrix structures in order to accomplish strategic objectives with conflicting priorities.

　　Demonstrated interpersonal skills including influencing, engaging, and motivating.

　　Must demonstrate strong communication skills.

　　Ability to work with multi-functional, multi-cultural teams.

　　Posting Statement

　　All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

　　Benefits

　　We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. (https://jobs.intel.com/en/benefits)

　　Position of Trust

　　This role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.