Our vision is to transform how the world uses information to enrich life for all .

　　Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

　　Micron's Advanced DRAM Technology Development group is seeking a Senior Process Development Engineer to join a growing team of Technology Development (TD) engineers in Boise responsible for developing, characterizing, and transferring manufacturing capable thin film bond-dielectric solutions for future interconnect and wafer level processing applications.

　　It is an exciting time to join the semiconductor industry! Advances in packaging technology based upon wafer-to-wafer level Hybrid and Fusion bonding will revolutionize the applications in which semiconductors will be used.

　　We are looking for a motivated, innovative and tenacious team member who will not only develop new solutions, but also inspire others to innovate and join the silicon revolution. In this role you will be the owner of several wafer level process steps and develop next generation processes and materials for interconnects that are enabled through wafer bonding.

　　We are seeking out candidates with knowledge and understanding of the films and techniques required to enable wafer-to-wafer bonding, including hybrid bonding, fusion boding as well of temporary bonding using both glass and silicon carriers.

　　Responsibilities:

　　Research and characterize bonding and layer transfer processes and equipment.

　　Own and develop processes on an array of thin films deposition equipment. build relationships with equipment vendors and evaluate equipment platforms, new materials, and processes for Micron’s Advanced DRAM Programs.

　　Opportunities for growing process knowledge in several additional process areas also exist.

　　Develop wafer bonding roadmap requirements that enable the Product technology roadmap and the metrics that will measure our progress towards the success criteria.

　　Collaborate and partner with customers, and process development teams engaged in enabling world class memory products which delight our customers and have quality and reliability as a foundation of our development philosophy.

　　Contribute knowledge and requirements to various teams, engage with vendors ethically, and keeping sustainability in mind in our processes and products.

　　Collaborate, direct and influence equipment suppliers in their roadmaps and equipment and process offerings in support of Micron’s technology needs and advancing our Interconnect capabilities and solutions.

　　The role requires excellent interpersonal skills and excellent technical skills. An effective team member will be helping other teams understand standard methodologies and how they will help efficiency, we are a group of innovators on a journey to strengthen our position as a global leader in memory and storage solutions by crafting semiconductor processes and maintaining tools, so we provide solutions which meet our cost, performance and efficiency goals and enabling our partners in manufacturing and our customers with processes which are capable.

　　Facilitate process development focus teams to come together and tackle problems, and celebrate success upon their completion.

　　Identifying and performing experiments and data collection methods resulting in recommendations for process improvements.

　　Delivering documentation for transitioning process from R&D to a pilot line or manufacturing environment.

　　Understanding upstream and downstream processes interactions and ensure that process customers and suppliers to your processes are known and requirements met.

　　Excellent documentation, organization skills are required for this position.

　　Communicate proposals, concepts and ideas to a varied range of audiences and professional levels.

　　The ability to prioritize activities and drive them to completion within budget, on time and as defined.

　　Minimum Education/Experience:

　　MS/PhD new grad or BS + 5 years industry experience specifically related to wafer bonding or wafer level packaging.

　　Academic Discipline(s): Materials Science, Chemical Engineering, Chemistry, Physics, Electrical Engineering, Mechanical Engineering, or related technical discipline

　　As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits .

　　Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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　　To learn more about Micron, please visit micron.com/careers

　　For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at [email protected] or 1-800-336-8918 (select option #3)

　　Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

　　Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.