Lead a team of process development engineers in development activities to support the OPM product and package development needs from ground zero to safe launch.

　　Provide innovative ideas and solution to support cost , yield , product performance improvement.

　　Establish Design Rules, Design of Manufacturing (DFM), Gap Analysis, feasibility studies, root cause & solution analysis, manufacturing support and documentation. 

　　Work in collaboration with equipment , tooling and material suppliers to understand capability and future roadmaps with respect to Power Packaging

　　Work closely with internal sites and subcons to resolve issues and to meet customer/BU marketing/sales requirements ie cost , quality & samples submission.

　　Have good working knowledge of assembly process preferably power packaging related ie Screen Print , Reflow , die/cu clip attach , wirebond , mold etc.

　　Have strong development fundamental skills ie DOE , SPC analysis , DFMEA , PFMEA etc.

　　Familiar with R&D system requirements

　　Job Requirement

　　Degree/Masters/PHD preferably of an Engineering course or Materials Science/Physics.

　　Minimum 10 years of hands-on process engineering experience with min 5 years in process development.

　　Performs other functions from time to time as may be assigned by supervisor.

　　The Company reserves the right to change your job duties from time to time to meet the needs of the business.

　　Wolfspeed is a powerhouse semiconductor company focused on silicon carbide and GaN technologies.

　　After more than thirty years of forging new technology adoption and transformation, our Wolfspeed® power and radio frequency (RF) semiconductors are leading the industry through unrivaled expertise and capacity.

　　If you require an accommodation to complete an online application, please contact accessHR at  +1 (919) 407-7333