Essential Duties & Responsibilities:

　　Managing a section of semiconductor packaging engineers including career planning and coaching, staffing of programs, operating policies and procedures, assessing and assigning training, systems process, interacting with human resources, product line management and finance.

　　Leading periodic section meetings, initiating discussions involving technical topics, project and program execution, bids & proposals, technology development and product road maps. Meeting individually with employees as necessary.

　　Monitoring performance of engineers including, periodic meeting with individuals, review performance and adjusting as necessary, end of year performance assessments and delivery, merit and equity planning and communication, assessing candidates for promotion.

　　Creating and maintaining new hire requisitions as needed, working with Talent Acquisitions for interview scheduling, interviewing internal and external candidates

　　Implement and, where required, improve internal design processes (ECN, NPI), documentation and requirements processes and work with the site management team in order to formalize change and approval flows.

　　Support program management organization (PMO) with properly staffing ongoing development programs.

　　Support product line management (PLM) in development of strategic proposals and quote activities by providing a basis of estimates (BOE) and providing technical guidance. Champion design discussion based on Micross technology and manufacturing process capabilities.

　　Assist the business development and project delivery teams by advising and conducting specification review and SOW interpretation.

　　Foster positive and effective business relationships at all levels and project phases.

　　Other Duties & Responsibilities:

　　Comply with all safety policies, practices and procedures

　　Comply with all quality and ITAR policies, practices and procedures

　　Build meaningful and productive relationships with internal business partners

　　Participate in proactive team efforts to achieve departmental and company goals

　　Contribute to building a positive team spirit

　　Communicate effectively with all levels of employees

　　Protect confidential information by not communicating, disclosing to, or using for benefit of 3rd parties

　　Maintain the highest degree of honesty and integrity at all times

　　Perform other duties as assigned

　　Requirements

　　Job Qualifications:

　　US citizenship or permanent resident alien status is required.

　　Bachelor’s or Master’s (preferred) degree in physics, mechanical, process or electrical engineering.

　　Job Skills:

　　A minimum of 15 years of working knowledge of semiconductor manufacturing and packaging, substrates or printed circuit boards with minimum of 5 years in first-line leadership role.

　　Experience working in a technical staff, product line leaders and executive management (COO, CTO), interacting with product partners, vendors, and affiliated business to resolve issues and obtain positive outcomes.

　　Experience creating, reading, and interpreting electronics schematics, one-line diagrams, etc.

　　Familiarity with power system analysis, mechanical (shock and vibration) modeling and RF effects and analysis.

　　Excellent knowledge and understanding of mechanical and electrical engineering principles.

　　Ability to debug and solve problems. Ability to collaborate and work as a part of a wider engineering team.

　　Ability to travel as needed.

　　Benefits

　　Medical, Dental, and Vision

　　401k

　　Company Paid Basic Life Insurance, STD, and LTD

　　Vacation Time

　　Sick Time

　　Holidays

　　Tuition Reimbursement

　　Pet Insurance

　　Legal Insurance offered through Allstate

　　Critical Illness, Hospitalization and Accident Insurance offered through Allstate