Applied Materials is the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale helps our customers – who make smartphones, supercomputers, virtual reality headsets, autonomous vehicles and more – transform their ideas into reality. Our innovations Make Possible® a Better Future.

　　Inside our company, we apply the idea of make possible as we work together. We value our people and teams who turn possibilities into reality by advancing our strategy, accomplishing great things and empowering others. We are deeply committed to fostering a Culture of Inclusion where every person knows they belong, feels empowered to bring their whole self to work, and is inspired to grow.

　　If you’re looking for a great place to grow your career, consider Applied Materials. With the data explosion and new investment in semiconductors, it’s an exciting place to be.

　　Applied Materials’ Advanced Packaging Department is searching for an intern to join our team in early 2024! Advanced packaging technology is critical to continue enabling Moore’s law through heterogenous integration of chiplets. Chiplets are integrated on the package thanks to novel wafer level processes such as hybrid bonding. New materials selection and integration within the hybrid bonding process flow are key to scale the next generation of interconnects. This internship will be focused on selecting, modelling, and integrating new materials for hybrid bonding technology. Understanding of materials behaviors and interaction will be a key component of the project, as well as modelling tools. The position will entail the following:

　　Literature review focused on equipment and chemistry of electroplating

　　Identify plating parameters unique to application: TSV fill, SAP, Damascene structures, etc

　　Present key finding and data summary in weekly meeting in front of engineering team

　　Set-up DOE and track outcome

　　Model based problem solving regarding new materials introduction and qualification

　　Define integrated flows to enable target (plating) outcome

　　Lab validation of advanced result (inspection, metrology)

　　Based at Applied Materials PPC campus, Kalispell, MT. Some domestic travel likely.

　　Requirements

　　Student must be pursuing a PhD’s degree program in Chemical Engineering, or a related field

　　Student must be in good academic standing at their university, with a preferred GPA of 3.0 or above on a 4.0 scale

　　Strong understanding of chemistry of materials behavior and electro-chemical reactions

　　Operate in high pace environment with autonomy.

　　Model-based problem-solving attitude with high tolerance for ambiguity is a plus for successful candidates.

　　Project Management skills

　　Knowledge of advanced packaging architecture is preferred

　　Electrical or Computer Engineering or related field with package design and Signal/Power Integrity analysis knowledge is a plus

　　Compensation

　　$42 - 46 per hour

　　The salary offered to a selected candidate will be based on a number of factors including location and education level and will vary depending on confirmed job-related knowledge, skills, and experience

　　Qualifications

　　Education:

　　Skills:

　　Certifications:

　　Languages:

　　Years of Experience:

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　　Additional Information

　　Time Type:

　　Full time

　　Employee Type:

　　Intern / Student

　　Travel:

　　Yes, 10% of the Time

　　Relocation Eligible:

　　Yes

　　Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.