Key Responsibilities

　　Key Product Unit, Process engineer for bump/FOWLP metallization product development at Applied Product Development Center (APDC).

　　Product development include Degas, PreClean and PVD technology, required to design, collect data, analyze and compile reports on moderately difficult experiments, within safety guidelines. Generate internal documentation for products, presentations and technical reports.

　　Perform new hardware characterization, tool issue troubleshooting, on moderately difficult systems, within safety guidelines. Basic hardware knowledge required.

　　Troubleshoot moderately complex problems, perform Root Cause Analysis and resolve moderately difficult engineering issues

　　Interact with customers to resolve moderately difficult engineering issues/problems.

　　Implement new technology, products and analytical instrumentation

　　Requirements:

　　PhD/ Master/ Bachelor in relevant Engineering/ Science/ Physics studies

　　Candidate with minimum prior experiences to few years experiences are welcome to apply

　　Understanding of semiconductor process and industry is compulsory

　　Resourceful, meticulous and problem-solving attitude

　　Working Location:

　　Science Park IIQualifications

　　Education:

　　Bachelor's Degree

　　Skills:

　　Certifications:

　　Languages:

　　Years of Experience:

　　2 - 4 Years

　　Work Experience:

　　Additional Information

　　Time Type:

　　Full time

　　Employee Type:

　　Assignee / Regular

　　Travel:

　　Yes, 20% of the Time

　　Relocation Eligible:

　　No

　　Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.