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LTD Advanced Interconnect Device Engineer
LTD Advanced Interconnect Device Engineer-March 2024
Hillsboro
Mar 28, 2026
ABOUT INTEL
Intel creates world-changing technology that enriches the lives of every person on earth.
10,000+ employees
Technology
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About LTD Advanced Interconnect Device Engineer

  Job Description

  The Logic Technology Development (LTD) team works in one of the most advanced semiconductor cleanroom facilities in the world. In this position, you will design, execute, and analyze experiments necessary to meet engineering specifications for LTD’s semiconductor manufacturing process.

  What we offer:

  We foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results. We give you opportunities to transform technology and create a better future, by delivering products that make the world a better place. Intel Corporation Core Values here (https://www.intel.com/content/www/us/en/corporate-responsibility/our-values.html?wapkw=our%20company) .

  Benefits:

  We provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs, and amenities, time off, recreational activities, discounts on various products and services, and many more creative rewards that make Intel a Great Place to Work! Find more information about our Amazing Benefits here (https://www.intel.com/content/www/us/en/jobs/benefits.html) .

  What we do:

  The Logic Technology Development (LTD) organization delivers the latest process technology innovations to drive Intel's amazing product roadmap. Look at Life Inside Intel here (https://www.intel.com/content/www/us/en/jobs/life-at-intel.html) .

  What you will be considered for:

  Define Interconnect performance targets for Process Design Kit releases, interface with design teams to understand Interconnect performance impact on overall technology entitlement commits.

  Use Statistics, Data Mining, and other data analysis techniques to collect, explore, and extract insights from Electrical-test, yield, and fab data.

  Develop scripts, algorithms, and applications to translate experimental data into intelligence to define future development direction.

  Define and Develop test structure design methodology to understand process marginality and performance capability of novel Interconnect processes.

  Benchmark silicon data capability against technology goals through RC compact model calibration.

  Propose and develop new compact model capabilities that accurately capture silicon behaviors.

  Qualifications

  You must possess the minimum qualifications below to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

  The experience listed below would be obtained through a combination of your schoolwork/classes and project work/ experimental research and/or relevant previous job and/or internship experiences.

  Minimum Qualifications

  You must possess a PhD degree in Electrical Engineering, Physics, Material Science, Chemical engineering or related fields to semiconductor fabrication.

  Minimum of 6-month experience in Semiconductor material characterization and fabrication.

  Minimum of 6-month experience in Electrical characterization of Semiconductor device or elements (I-V, C-V, etc.)

  Preferred Qualifications

  Experience in process monitoring structure layout design and testing.

  Experience in Semiconductor Interconnect fabrication and characterization

  Expertise in database structures, research methods, machine learning, analytics packages (i.e., JMP, MATLAB, Octave), scripting languages (i.e., Python, JSL, Perl, TCL), or programming languages (i.e., SQL, C/C++)

  Basic knowledge of CMOS device, Ring oscillator, integrated Circuits are a plus.

  Inside this Business Group

  As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

  Posting Statement

  All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

  Benefits

  We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. (https://jobs.intel.com/en/benefits)

  Working Model

  This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.

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