Job Description

　　Intel's pursuit of Moore's law drives constant state of the art innovations in Process and Packaging areas. Intel and the industry are entering the era of advanced packaging and Intel has brought in breakthrough advances in packaging through EMIB and Foveros technologies as announced in 2021.To further advance heterogenous integrated packaging capability over the next decade we are putting together a dedicated team, tooling and FAB to drive wafer level assembly technology development (WATD) in the Ronler campus in Oregon. Intel WATD at Intel Hillsboro is a technology development organization to develop future generations of heterogenous integrated packaging process technologies through innovation, product enhancement, as well as developing and enabling equipment and process capabilities.

　　This job requisition is to seek a candidate to be the Manufacturing development Process Engineer in multiple process areas (CMP, Dry etch, Wet etch, Film deposition, Electro-plating, Lithography).

　　Responsibilities include but are not limited to the following:

　　Sustaining support for integrated circuit or semiconductor processes.

　　Improving, sustaining, and co-developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.

　　Innovating, problem solving, supporting development, and continuously improving equipment and processes using experimental design and statistical methods.

　　Provide process and equipment specification feedback, applying principles for design of Experiments and data analysis, planning and documentation of improvements through the spec/Best Known Method (BKM).

　　Developing solutions to problems utilizing formal education, statistical knowledge, and problem-solving tools.

　　Technical leadership skills:

　　Self-initiative, leadership, strategic shift planning, coaching and supporting the development of a technical team.

　　Successfully participate in a highly matrix environment managing resources and timelines, as well as proven stakeholder management.

　　Flexibility in changing priorities and responsibilities to support business needs.

　　Tolerance for ambiguity in a fast paced, constantly changing product roadmap environment.

　　Action-oriented by influencing, communication skills and work independently.

　　Qualifications

　　For information on Intel’s immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information (https://www.intel.com/content/www/us/en/jobs/hiring.html) .

　　You must possess the below requirements to be initially considered for this position.

　　Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

　　Knowledge and/or experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.

　　Minimum Requirements:

　　Must possess a Bachelor's degree (2+year experience), Master's degree (1+ year experience) Or PHD in Engineering, Materials science, Chemistry, Physics, or related field.Preferred qualifications:

　　Working relationship with Area and Program-level decision-makers in Yield, Operation, and across Functional Areas, and is recognized as an expert.

　　Leads or represents the Module or Area at one or more forums, such as Task Forces, integrated focus teams, Program meetings, Working Groups, Operation focus team, defect reduction team, Focus Teams, etc. Highly self-sufficient, seeking only high-level context from manager.

　　Inside this Business Group

　　As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

　　Posting Statement

　　All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

　　Benefits

　　We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. (https://jobs.intel.com/en/benefits)

　　Working Model

　　This role will require an on-site presence.